Sliding bearing remission coating process is introduced and applied
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4 and the function of each component content in the plating solution back to back in addition to the effect
4.1 sodium acetate
Sodium acetate (NaAC. 2 h2o) as the main function of conductive salt. It can increase the bath, to reduce the cell voltage, the conductivity of the rise of temperature of the bath will not too fast, and save energy at the same time. Content is too high then the slot liquid out of the loss, bath content is too low, the electrical conductivity of the lower temperature rise too fast, consume energy. Its content is determined by experiment in 150 - a - 2509 is advisable.
Second, in the anode oxidized form of lead (ii) (PbZ ten) and acetic acid ions (AC), has the certain complexing ability, the generated complex ion (PbAC +) and complex (PbAq) in water solubility. Therefore, sodium acetate and have played an important role in the anode activator [7 ".
4.2 buffer
Buffer for inorganic acid. With just the right amount of buffering agent, can make bath pH change slowly. The buffer at pH 8.24 oct and within the range of 11.74 a 13.74 significant cushioning. When its content is less than 309, the buffer effect is not obvious. Due to the limit of solubility, its content also shoulds not be more than 409 / L, otherwise the temperature lower crystallization precipitation, and out of the losses are increased. So its content with 30 a 409 several advisable.
4.3 corrosion inhibitor
In order to make the remission in the coating process of the exposed part of the substrate and the first uninsulated steel back from corrosion, and the right amount of corrosion inhibitor is beneficial. The corrosion inhibitor for organic sulfur compound or organic nitrogen compounds, it has a selective adsorption on the substrate and the surface of the steel back, make its potential is moving, the corrosion effect effectively.
5 process parameters control of plating effect
5.1 the anode current density
Anode hydrogen evolution is too intense, bath pH value rise too fast. Anode current density control in 4 a SA within the range of a/d frame is better.
5.2 the temperature
Temperature is too low to reduce solubility of each component in the solution, so as to reduce the conductivity of the solution, cause the current rise will not come up. Bath temperature, evaporation speed, peculiar smell significantly, is not in conformity with the requirements of environmental protection. Control the temperature of bath under 40 ℃ is appropriate.
5.3 time
Back in addition to 0. 02 a 0.03 mm thick unqualified plating takes about 10 a 15 min. Two thirds of the time, before the anode current density can rise to upper limit. After a third of the time, the anode current density can be controlled in lower limit, the plating of copper, tin, almost in the form of anode slime is stepping down.
5.4 PH
When lead a tin copper ternary alloy plating in backing down plating solution in the anode in the process of plating, and the pH value in the range of technology, along with the rising of anode current density, lead, tin, the potential of copper is subsequently is moved, lead in corrosion state, the remission can be smoothly; Copper and tin in passivation zone. Lead in the plating is more than 80%, is the main ingredient. When remission of lead, copper, tin, is in the form of anode slime by mechanical stripping down. Confirmed by trial and error, the bath pH control within the range of 10 a 12 remission can meet the requirements.
5.5 Yin and anode spacing
Yin, the distance between the anode maintain ideal between 5 a 10 cm. Yin and Yang bath pole spacing is too small, scattered ability reduce remission rate is large, local will prematurely exposed substrate. Conversely slot voltage increases, temperature rise too fast.
6 process features and benefits
234407BM 234706BM 234406BM 517/2860V/YA 5610/2500 517/1720X1V 527/1181M 510/1180M 517/930 510/670 590/560 510/500 52780 59080 517/368M 51760U 517/238 6207-2ZN 6206-2ZN 6205-2ZN 6204-2ZN 6203-RZ 6203-2ZN 6202N 6202-2ZN 6201-2ZN 6200ZZ 6200-2ZN 62/32-ZN 62/32-Z 62/32N 62/32-2Z 62/32-2RZ 62/32-2RS 62/28-2RZ 62/22-2RZ 61996 61992 61988 61984
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Sliding bearing remission coating technology introduction and application of cathode materials for ordinary carbon steel. In addition to the speed of about 2 fem/min. Be back in an mmo coating thickness of 0.02-0.024 and the function of each component content in the plating solution back to back in addition to the effect
4.1 sodium acetate
Sodium acetate (NaAC. 2 h2o) as the main function of conductive salt. It can increase the bath, to reduce the cell voltage, the conductivity of the rise of temperature of the bath will not too fast, and save energy at the same time. Content is too high then the slot liquid out of the loss, bath content is too low, the electrical conductivity of the lower temperature rise too fast, consume energy. Its content is determined by experiment in 150 - a - 2509 is advisable.
Second, in the anode oxidized form of lead (ii) (PbZ ten) and acetic acid ions (AC), has the certain complexing ability, the generated complex ion (PbAC +) and complex (PbAq) in water solubility. Therefore, sodium acetate and have played an important role in the anode activator [7 ".
4.2 buffer
Buffer for inorganic acid. With just the right amount of buffering agent, can make bath pH change slowly. The buffer at pH 8.24 oct and within the range of 11.74 a 13.74 significant cushioning. When its content is less than 309, the buffer effect is not obvious. Due to the limit of solubility, its content also shoulds not be more than 409 / L, otherwise the temperature lower crystallization precipitation, and out of the losses are increased. So its content with 30 a 409 several advisable.
4.3 corrosion inhibitor
In order to make the remission in the coating process of the exposed part of the substrate and the first uninsulated steel back from corrosion, and the right amount of corrosion inhibitor is beneficial. The corrosion inhibitor for organic sulfur compound or organic nitrogen compounds, it has a selective adsorption on the substrate and the surface of the steel back, make its potential is moving, the corrosion effect effectively.
5 process parameters control of plating effect
5.1 the anode current density
Anode hydrogen evolution is too intense, bath pH value rise too fast. Anode current density control in 4 a SA within the range of a/d frame is better.
5.2 the temperature
Temperature is too low to reduce solubility of each component in the solution, so as to reduce the conductivity of the solution, cause the current rise will not come up. Bath temperature, evaporation speed, peculiar smell significantly, is not in conformity with the requirements of environmental protection. Control the temperature of bath under 40 ℃ is appropriate.
5.3 time
Back in addition to 0. 02 a 0.03 mm thick unqualified plating takes about 10 a 15 min. Two thirds of the time, before the anode current density can rise to upper limit. After a third of the time, the anode current density can be controlled in lower limit, the plating of copper, tin, almost in the form of anode slime is stepping down.
5.4 PH
When lead a tin copper ternary alloy plating in backing down plating solution in the anode in the process of plating, and the pH value in the range of technology, along with the rising of anode current density, lead, tin, the potential of copper is subsequently is moved, lead in corrosion state, the remission can be smoothly; Copper and tin in passivation zone. Lead in the plating is more than 80%, is the main ingredient. When remission of lead, copper, tin, is in the form of anode slime by mechanical stripping down. Confirmed by trial and error, the bath pH control within the range of 10 a 12 remission can meet the requirements.
5.5 Yin and anode spacing
Yin, the distance between the anode maintain ideal between 5 a 10 cm. Yin and Yang bath pole spacing is too small, scattered ability reduce remission rate is large, local will prematurely exposed substrate. Conversely slot voltage increases, temperature rise too fast.
6 process features and benefits
